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Job Posting
Posted 2 days ago
Closes Jun 12, 2026

Packaging Module Development Engineer

Intel Phoenix, Arizona $134K – $134K

Listing sourced from adzuna on 5/14/2026. CVCraft does not host this job; clicking Apply redirects to the source.

Job Description

Job Details: Job Description: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing. The Packaging Module Development Engineer will contribute to advancing tec…

Salary Context for Product Manager

The US national median for Product Manager is $138,360; in Phoenix the median is $138,360 (+0% vs national).

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